Crystalclean
Cleaning solution capable of removing particles and metal ion impurities from semiconductor and sapphire wafers. Designated for ultrasonic cleaning.
Crystalclean: quality and reliability

Approved efficiency
40% reduction of residual contamination density on the surface after cleaning*.
4-10 times reduction of Fe, Ca, Cr, Cu ion impurities**

High epitaxial yields
Provided by high purity of agent’s components

Great washability
No stains on wafers surface after cleaning

Cost efficiency
Agent’s lifetime is 70% higher than that of competitors

High productivity
Twice higher cleaning equipment throughput with Crystalclean
* according to in-house comparison tests performed by Candela optical analyzer
**according to TXRF comparative test results with comparable agents