Conductive silver pastes for back side contact formation

BSP-111

Application: The new developed silver composition represents new BSP family of high quality Monocrystal tabbing pastes. BSP-111 is a back side conductive metallization material which provides low resistant ohmic contact and excellent adhesion after soldering. Significantly reduced silver content and lay down helps a lot in lowering production costs per Watt.

Benefits:

• Low consumption
• High adhesion
• Good solderability
• Excellent printability and rheology
• Good contact with Silicon

BSP-112

Application: A Lead and Cadmium free BSP-112 tabbing paste allows Customers to “Go Green”, while keeping all features of lead – containing product.

Benefits:

• Low consumption
• High adhesion
• Good solderability
• Environmentally friendly material
• Excellent printability and rheology
• Good contact with Silicon