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PRODUCTION FACILITIES

Monocrystal PLC: production facilities

Monocrystal has advanced technologies and high-tech equipment for sapphire Al2O3 production. We carry out all the technological stages from crystal growing to epi-ready substrates production.

We grow optical grade material (Al2O3 99.997%) using high purity aluminum oxide as raw material.

We carry out the following production stages:

  • crystal growing
  • slicing
  • grinding
  • diamond polishing
  • chemical-mechanical planarization
  • silicon-on-sapphire (SOS) epitaxial deposition

Total production facilities area is 150 000 square feet with 25 000 square feet of clean rooms.

Sapphire Growing
Monocrystal implements exclusive Kyropoulos crystal growing method, that allows to manufacture sapphire boules up to 250 mm diameter. Due to the unique technology of raw material (Al2O3 powder) preliminary preparation Monocrystal is able to offer the purest (99,997%) single crystal sapphire in the world with the Ti content less than 1ppm.

Slicing
Our company employs advanced technology and equipment for crystal slicing:

-- wire-sawing for sapphire substrate slicing
-- ID sawing for optical parts and watch glass blanks slicing

Both techniques allow Monocrystal to choose the most effective method for each application. Fully automatic wire saws enable us to cut sapphire substrates very precisely according to customers' specification.

Grinding
Our company offers precise grinding and lapping and has developed a proprietary process to achieve minimal material stress and higher yield for final processor. We are capable to achieve perfect flatness and total thickness variation and specialize in very tight tolerances.

Polishing
High quality, high precision optical polishing of sapphire products, used in a variety of industries, is provided by Monocrystal. Surface finish is according to MIL-0-13830A standard up to 10/5 scratch/dig or 10 Angstroms.

CMP
Chemical mechanical planarization is a sapphire substrate preparation technique which is required before the process of adding the pattern layer to the surface of the wafer applied in the manufacturing of semiconductor devices.

This advanced processing facility has been designed at our plant for the fabrication of latest generation epi-polished sapphire substrates.