Narrow wavelength distribution on SG-wafers:
- Unparalleled sapphire uniformity: furnace-to-furnace, crystal-to-crystal, ingot-to-ingot
- >1% yield improvement for tightest wavelength distribution specs
- Wafer shape management improving wavelength distribution, both within a wafer and wafer-to-wafer
MicroLED enabler
- 20-50 particles of no more than 1 micron in size on the surface
- Extra-large (6-, 8-inch) sapphire wafers in mass production
- Homogeneous crystal structure of extra-large wafers provides controlled thermal bow
Unique source of microLED-ready wafers:
- Largest vertically integrated sapphire company
- New factory for microLED sapphire wafers under construction
- 50% share on extra-large (6-, 8-inch) sapphire wafers market
Zero breakage during epi-process and edge chips at dicing
- Low internal stress sapphire material
Higher transmission in a wide range from UV to IR
- High sapphire purity (lowest Ti and Mo content)
- No yellowing under UV exposure
Uniform etching in PSS process
- Single sapphire source results in excellent pattern size repeatability
- 90% yield for D28 pattern type
Higher photolithography process yields
- Based on precise flatness and LTV control
- No PSS yield losses due to shot fail
- 30% increase in PSS-line throughput by enlarging shot stepper size from 7×7 to 10×10