Quality and reliability


Cleaning solution capable of removing particles and metal ion impurities from semiconductor and sapphire wafers. Designated for ultrasonic cleaning.

Crystalclean: quality and reliability

Approved efficiency

40% reduction of residual contamination density on the surface after cleaning*.
4-10 times reduction of Fe, Ca, Cr, Cu ion impurities**

High epitaxial yields

Provided by high purity of agent’s components

Great washability

No stains on wafers surface after cleaning

Cost efficiency

Agent’s lifetime is 70% higher than that of competitors

High productivity

Twice higher cleaning equipment throughput with Crystalclean

* according to in-house comparison tests performed by Candela optical analyzer
**according to TXRF comparative test results with comparable agents

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